Intel: Kaby-Lake chips, mainboard and Optane storage as a bundle

The Optane memory, presented together with the Kaby-Lake chips, is intended to provide a high performance, but the interest is limited – not least because of the high investment costs.

With the Optane data storage, Intel is focusing on a so-called 3D Xpoint memory technology, which is supposed to achieve significantly higher performance than conventional NAND SSDs. First storage solutions on this basis were already presented in January – together with the Kaby-Lake chips. However, demand is still low, which should not be least due to the associated costs, which are comparatively high. In addition to the processor and memory, a mainboard with a 200-series chipset is also required.

Now the Chiphersteller seems to want to prepare a bundle in order to boost the sales especially with users who assemble their computer in self-government. As a kind of platform, processor, board and memory will be provided in a package. It is still unclear how exactly these packages are to be designed, which seem to come to the dealers in the third quarter. Currently there are about 130 motherboards that support the Optane memory.

Related Post

Intel Already Have 5G Modem and Network Ecosystem Intel has just announced its readiness to become a major player in the 5G network technology. Not only that, Intel is already preparing a special road...
Will i5 6600k 4.6 or lower ghz bottleneck Gtx 960 ... If you asked Will i5 6600k 4.6 or lower ghz bottleneck Gtx 960 4gb? really confusing. Looked up online and the majority of the people said you will, b...
Nvidia Battlebox for the first time alongside AMD ... Nvidia recommends first AMD CPUs for use in a Battlebox. The VGA comes naturally only from Nvidia. For several years, Nvidia has been working with ...
Intel Separates from McAfee Intel has released the security company McAfee in the independence and retains only a minority participation in the company. Intel announced the mo...
Share

Leave a Reply

Your email address will not be published. Required fields are marked *